PCB Fabrication Specs
| Specs | Standard | Custom |
|---|---|---|
| Layer Count | 0 ‐ 10 Layers | 0 ‐ 40 Layers |
| Turn Time | 2 Days ‐ 4 Weeks | 2 Days ‐ 4 Weeks |
| Quantity Req. | 1 ‐ 10000+ | 1 ‐ 10000+ |
| Materials | FR‐4 | FR‐4/ Rogers/ Polyimide/ Aluminum Clad/ 370HR |
| Plating Finish | Lead‐Free HAL | Electrolytic Hard Gold/ Soft Gold/ ENIG/ Nickel/ Immersion Silver OSP/ Leaded & Lead‐Free HAL |
| Cert. / Qualifications | IPC Class 2 ‐ A600 | IPC6012 Class 2‐3A/ IPC6018 Class 3 MIL‐PRF‐ 31032/ MIL‐PRF‐55110/ ISO 9001:2008/ AS9100C |
| Board Thickness | 0.062" | .031"/ .062"/ .093"/ .125" |
| Copper Weight | 1 oz. Inner / Up to 2 oz. Outer | 0.5 ‐ 4 oz. Inner/ 1‐20 oz. Outer |
| Trace/Space | 5 Mils | Down to 3 Mils |
| Solder Mask (LPI) | Green | Various Color Options |
| Legend | White | Various Color Options |
| Min. Hole Size | 10 MIL | Down to 4 MIL |
| Hole Tolerance | +/‐ 0.005" | +/‐ 0.003" (Upon Request) |
| Rout Tolerance | +/‐ 0.010" | +/‐ 0.005" (Upon Request) |
| Slots/Cutouts/Edges | Non‐Plated Only | Plated/ Non‐Plated |
| Plated Holes | Plated / Non‐Plated | Plated/ Non‐Plated |
| UL Markings/Dates | Yes | Yes |
| Lead‐Free Markings | Yes | Yes |
| Gold Fingers | Yes | Yes |
| Fiducials | Yes | Yes |
| Scoring | Yes | Yes |
| ITAR | Yes | Yes |
| Castellated Holes | X | Yes |
| Controlled Dielectric | X | Yes |
| Controlled Impedance | X | Yes |
| Counter Sinks | X | Yes |
| Counter Bores | X | Yes |
| Blind/Buried Vias | X | Yes |
| Microvias | X | Yes |
| Mask Plugged Vias | X | Yes |
| Via‐in‐Pad | X | Yes |
| Etch Back | X | Yes |
| Cover Coat | X | Yes |
| Cavity Process | X | Yes |
| Laser Rout | X | Yes |
| Back Drilling | X | Yes |
| Controlled Depth Drill | X | Yes |
PCB Assembly Specs
| Specs | Standard | Custom |
|---|---|---|
| Quantity Req. | 1 ‐ 10000+ | 1 ‐ 10000+ |
| Turn Time | 2 Days ‐ 4 Weeks | 2 Days ‐ 4 Weeks |
| Stencil Make | Laser Cut | Laser Cut |
| Stencil Material | Myler/Polyethylene (limited to 25 use) | Stainless Steel (one time cost) |
| Stencil Thickness | 4 mil | 4 mil |
| Placement Accuracy | 0.01 mm | 0.01 mm |
| Maximum Circuit board size | 17.7"x11.8" | Any size |
| Componont size | 0201, 0402, 0603, 0805, 1206, diode, audion, SOT, QFP, Within 40*40mm and the pin distance ≥0 .3mm | 0201, 0402, 0603, 0805, 1206, diode, audion, SOT, QFP, Within 40*40mm and the pin distance ≥0 .3mm |
| Through hole and special compononts | Hand soldering | Wave soldering, Hand soldering |
| Automatic Optical Inspection (AOI) | Solder paste printing coverage, offset printing, open solder, short solder, presence/absence component, offset placement, skew, tombstone, wrong component, black pad contamination, solder pad chipout. | Solder paste printing coverage, offset printing, open solder, short solder, presence/absence component, offset placement, skew, tombstone, wrong component, black pad contamination, solder pad chipout. |